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Hot Air Reflow Market Size & Share, 2018 | Industry Research Report

Hot Air Reflow Industry 2018 Market Research Report

Report ID: MN17615567  |  Published: July 2017  |  No of Pages: 92
Format: Electronic (PDF)  |  Industry: Machinery and Machine Parts  |  Publisher: QY Research

Global Hot Air Reflow Market is expected to rise at a moderate CAGR in the forthcoming period. A hot air reflow is a multipurpose soldering device with a combination of soldering station, hot air rework and a DC power supply. These functions can be performed simultaneously or independently resulting into occupying a less area with efficient energy output. Technically, hot air reflow corrects polarized parts, tombstone parts, and cold joints and eliminates defective parts that happen to go unnoticed during the manufacturing process. Further, hot air reflow station is also useful to adjoin missing components and jumpers.

Other uses of hot air reflow include reduction of heat shrink onto wires, recovering electronic components from old circuit boards. On a commercial level, the market for hot air reflow station is gaining a positive traction and also accounting for a significant market position. Driving factors responsible for the growth hot air reflow market includes rise in manufacture of circuit boards that demand soldering accuracy. Also, hot air reflow fixes the errors after manufacture of PCBs which again is considered important from manufacturing point of view, thus adding to the market growth for hot air reflow components.

Based on segmentation by type, the hot air reflow industry includes 7 zone reflow system, 10 zone reflow system and 12 zone reflow system. Based on segmentation by application, the hot air reflow market includes medical electronics, consumer electronics and automotive electronics.

Geographically, hot air reflow market spans North America, Latin America, Europe, Asia-Pacific, Middle-East and Africa. APAC market is expected to gain a positive traction in the forthcoming period due to soldering demands in industrial sector. North America and Europe market is also expected to gain a significant share in the global market. MEA regions are anticipated to grow at a higher CAGR in the forthcoming period due to the rise in construction activities and heavy presence of industrial and manufacturing sector and also demand for printed circuit boards. The key players in the hot air reflow market include HELLER, ERSA, BTU, JT, Dongguan Pengyi Electronics, Leadsamt and Shenzhen.

Market Segment:

The major manufacturers covered in this report
• HELLER
• ERSA
• BTU
• JT
• Dongguan Pengyi Electronics
• ShenZhen Leadsmt

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
• North America
• Europe
• China
• Japan
• Southeast Asia
• India

We can also provide the customized separate regional or country-level reports, for the following regions:
• North America
• United States
• Canada
• Mexico
• Asia-Pacific
• China
• India
• Japan
• South Korea
• Australia
• Indonesia
• Singapore
• Rest of Asia-Pacific
• Europe
• Germany
• France
• UK
• Italy
• Spain
• Russia
• Rest of Europe
• Central & South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Saudi Arabia
• Turkey
• Rest of Middle East & Africa

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
• 7 Zone Reflow System
• 10 Zone Reflow System
• 12 Zone Reflow System
• Other

On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including
• Medical Electronics
• Consumer Electronics
• Automotive Electronics
• Other

The key points of this report are:
• To analyze and study the global Hot Air Reflow capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);
• Focuses on the key Hot Air Reflow manufacturers, to study the capacity, production, value, market share and development plans in future.
• Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
• To define, describe and forecast the market by type, application and region.
• To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
• To identify significant trends and factors driving or inhibiting the market growth.
• To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
• To strategically analyze each submarket with respect to individual growth trend and their contribution to the market
• To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
• To strategically profile the key players and comprehensively analyze their growth strategies.

Key Stakeholders
• Hot Air Reflow Manufacturers
• Hot Air Reflow Distributors/Traders/Wholesalers
• Hot Air Reflow Subcomponent Manufacturers
• Industry Association
• Downstream Vendors

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Ryan Manuel
Ryan Manuel

Research Support Specialist, USA

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