Global Lead Frame Market is segmented on the basis of types, layer, application, and region. A lead frame is a thin layer of metal frame to which semiconductors are attached during the package assembly process. Quality of the lead frame is of essential importance that is any tiny defect seriously risks the performance and reliability of the result IC (integrated circuit) device. Lead frames are used in nearly every semiconductor package.
Most kinds of integrated circuit packaging are made by having placed the silicon chip on a lead frame, and then wire bonding the chip to the metal leads of that lead frame, and then covering the chip with plastic. The main function of the lead frame is that of transmitting the signal from the die to the electronic fitment attached at the outer end. As per the application and utility, the lead frame gets molded into the desired structure.
The lead frame market is mainly driven by consumer electronics equipment. Increasing usage of equipment in daily activities is expected to drive the demand for consumer electronics; which is expected to boost the lead frame market further. Moreover, the growing usage of technology in pharmaceutical, healthcare, industrial automation is projected to drive the consumption of the lead frame market.
On the other hand, lead frame market is facing constraints owing to the lethargic growth in automotive sector that is one of the leading contributors to demand for lead frame. Lead Frame Market is classified, by type into Stamping Process Lead Frame, Etching Process Lead Frame, and Others. Stamping Process Lead Frame is an automated, high speed process suitable for large production rates that make the initial high tooling costs tolerable. Etching Process Lead Frame is suitable for the low volume production and new product development.
Lead Frame Market is classified, by layer into Single Layer Lead Frame, Dual Layer Lead Frame, and Multilayer Lead Frame. Multilayer lead frame is an efficient heat diffuser particularly suited for devices that require superior thermal dissipation. Lead Frame Market is classified, by application into Integrated Circuit, Discrete Device, and other. Lead Frame Market is segmented, geographically into North America, Europe (Eastern Europe, Western Europe), Asia Pacific, Latin America, Middle East and Africa.
Asia Pacific is expected to be foremost market in terms of volume and value for the lead frame industry. Their is strong demand in Asia Pacific regions especially in Japan, China and Korea due to its wide-ranging electronics equipment manufacturing practices is expected to contribute a great deal in the lead frame industry; followed by North America, and is projected to be the leading industry for the lead frame market mainly driven by rapidly growing and large consumer base.
Europe is also expected to be a substantial contributor, especially driven by growth in lead frame application sectors such as industrial automation equipment manufacturing practices. The Middle East and Africa is estimated to show the lethargic growth in the years to come. Lead Frame Industry key players are SH Materials, Mitsui High-Tech, SDI, Shinko, ASM Assemble Materials Limited, Samsung, POSSEHL and I-Chiun.
This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering
• SH Materials
• Mitsui High-tec
• Dynacraft Industries
• ASM Assembly Materials Limited
• LG Innotek
By types, the market can be split into
• Stamping Process Lead Frame
• Etching Process Lead Frame
By Application, the market can be split into
• Integrated Circuit
• Discrete Device
By Regions, this report covers (we can add the regions/countries as you want)
• North America
• Southeast Asia
Research Support Specialist, USA