Global Wire Bonder Equipment Market displayed a higher CAGR in the assessment period owing to augmented applications and expanded scope across varied sectors. Wire Bonder Equipment is a semiconductor device that has come up as one of the most economical interconnect technology. Also, it is used to accumulate varied semiconductor packages. The manufacturers are undertaking significant investments in order to advance the devices with the help of latest technologies. The market has attained huge recognition across various sectors owing to burgeoning demands and prerequisites.
The prominent factors that contributed in boosting up the Wire Bonder Equipment Market growth may entail rise in the industrialization, technological innovations, rising incentives and discounts for long-term customers, augmented usage of 3D chip packaging, and robust growth of semiconductor industry. Additionally, the manufacturers took up various strategies such as partnerships, acquisitions, and joint ventures that eventually contributed in the inorganic growth of the Wire Bonder Equipment Industry.
On account of all the above aspects, it is projected that the Wire Bonder Equipment Sales Industry will register a healthy CAGR in the upcoming period. The only factor that is impeding the overall Wire Bonder Equipment Market growth may entail high investments. Wire Bonder Equipment Industry can be split up by product type, end user, and geography. The market is segregated by product type as Wedge Bonders, Ball Bonders, Stud-Bump Bonders, and others. The market is segmented by application as Outsourced Semiconductor Assembly and Testing (OSATs), Integrated Device Manufacturer (IDMs), and others. Wire Bonder Equipment Industry is classified by geography as North America, Europe, China, Japan, Southeast Asia, and India.
North America witnessed a huge growth in the Wire Bonder Equipment Market owing to augmented production, rising applications, and mounting investments by the leading manufacturers. Conversely, Asia Pacific and Europe also expanded at a significant rate due to developing economies, huge customer base, rising prerequisites, and rise in the market growth opportunities in these regions.
The key players who contribute to the robust development of the Wire Bonder Equipment Market are identified as ASM Pacific Technology, Applied Materials, Palomar Technologies, BE Semiconductor Industries, F&K Delvotec Bondtechnik GmbH, Hesse Mechatronics, HYBOND, Inc, Shinkawa Electric, Toray Engineering, DIAS Automation, West Bond, and Kulicke, and Soffa Industries.
Geographically, this report is segmented into several key Regions, with production, consumption, revenue (million USD), market share and growth rate of Wire Bonder Equipment in these regions, from 2013 to 2025 (forecast), covering
• North America
• Southeast Asia
Global Wire Bonder Equipment market competition by top manufacturers, with production, price, revenue (value) and market share for each manufacturer; the top players including
• ASM Pacific Technology
• Kulicke and Soffa Industries
• Applied Materials
• Palomar Technologies
• BE Semiconductor Industries
• F&K Delvotec Bondtechnik GmbH
• DIAS Automation
• West Bond
• Hesse Mechatronics
• HYBOND, Inc
• Shinkawa Electric
• Toray Engineering
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
• Wedge Bonders
• Stud-Bump Bonders
• Ball Bonders
On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including
• Integrated Device Manufacturer (IDMs)
• Outsourced Semiconductor Assembly and Testing (OSATs)
Research Support Specialist, USA